JPS6287438U - - Google Patents
Info
- Publication number
- JPS6287438U JPS6287438U JP17923385U JP17923385U JPS6287438U JP S6287438 U JPS6287438 U JP S6287438U JP 17923385 U JP17923385 U JP 17923385U JP 17923385 U JP17923385 U JP 17923385U JP S6287438 U JPS6287438 U JP S6287438U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- workpiece
- reflection point
- bonding head
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17923385U JPS6287438U (en]) | 1985-11-21 | 1985-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17923385U JPS6287438U (en]) | 1985-11-21 | 1985-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6287438U true JPS6287438U (en]) | 1987-06-04 |
Family
ID=31122111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17923385U Pending JPS6287438U (en]) | 1985-11-21 | 1985-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6287438U (en]) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519374A (ja) * | 1974-07-12 | 1976-01-26 | Hitachi Ltd | Kakudaigazooryoshita bondeinguhoho |
| JPS5412668A (en) * | 1977-06-30 | 1979-01-30 | Toshiba Corp | Position deciding method for semiconductor component and wire bonding device the said method |
-
1985
- 1985-11-21 JP JP17923385U patent/JPS6287438U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS519374A (ja) * | 1974-07-12 | 1976-01-26 | Hitachi Ltd | Kakudaigazooryoshita bondeinguhoho |
| JPS5412668A (en) * | 1977-06-30 | 1979-01-30 | Toshiba Corp | Position deciding method for semiconductor component and wire bonding device the said method |